| BGA表面贴装技术及过程控制 |
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| 引用本文： | 汪思群,王柳. BGA表面贴装技术及过程控制[J]. 电子工艺技术, 2011, 32(3): 152-155,172 |
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| 作者姓名： | 汪思群 王柳 |
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| 作者单位： | 连云港杰瑞电子有限公司; |
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| 摘 要： | SMT(表面贴装技术)与SMD(表面贴装器件)不断发展更新,BGA顺应时代潮流成为高频化、高I/O数及小型化封装的最佳选择.但是BGA焊接后焊点质量的保证及其返修却是令生产者头疼的问题.简要介绍BGA器件、BGA器件发展现状和应用情况,重点论述BGA生产中应用的检测方法和返修工艺.
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| 关 键 词： | 表面贴装技术 BGA封装 过程控制 检测 返修 |
Surface Mount Technology and Process Control of BGA |
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| WANG Si-qun,WANG Liu. Surface Mount Technology and Process Control of BGA[J]. Electronics Process Technology, 2011, 32(3): 152-155,172 |
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| Authors: | WANG Si-qun WANG Liu |
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| Affiliation: | WANG Si-qun,WANG Liu(Lianyungang Jari Electronic Co.,Ltd,Lianyungang 222006,China) |
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| Abstract: | SMT(Surface mount technology) and SMD(Surface mount devices) development continuously.Now BGA has become the best choice for high frequency,high I/O number and small package.However,the reliability of BGA solder joint quality after soldering and rework and repair of BGA are problems which make producer headache.Introduce the concept of BGA and its development status and application.Discuss the inspection and rework and repair technologies of BGA. |
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| Keywords: | SMT BGA Process control Inspection Rework and repair |
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