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电子设备三维布线工艺技术应用研究
引用本文:周三三,刘恩福.电子设备三维布线工艺技术应用研究[J].电子工艺技术,2011,32(4):227-228,232.
作者姓名:周三三  刘恩福
作者单位:南京电子技术研究所,江苏,南京,210039
摘    要:电子设备传统的工艺布线主要是根据实物及其接线关系构建线束,绘制二维平面图,在样板上制作线束.因应电子设备模块化、集成化和批量化的发展趋势,介绍了在Pro/E软件制作三维图的基础上进行三维布线构建数字化样机,并与二维布线比较,分析了三维布线对电子设备带来的影响,介绍了三维布线工艺的应用研究情况.

关 键 词:数字化样机  三维布线  线缆展平

Study on 3D Cabling Technology Application of Electronic Device
ZHOU San-san,LIU En-fu.Study on 3D Cabling Technology Application of Electronic Device[J].Electronics Process Technology,2011,32(4):227-228,232.
Authors:ZHOU San-san  LIU En-fu
Affiliation:ZHOU San-san,LIU En-fu(Nanjing Research Institute of Electronic Technology,Nanjing 210039,China)
Abstract:The traditional cabling technology built cables according to the device and its connecting relationships,then drew 2D ichnography,and finally built cables on the template.With the development of modularization,integration and batched production of the electronic device,a new 3D cabling method is introduced on the base of Pro/E software.Comparing with 2D cabling,analyse advantages of 3D cabling,and also focuses on the application of 3D cabling technology.
Keywords:Digitalized pattern  3D cabling  Cable flattening  
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