紫外光固化导电胶基体固化动力学分析

紫外光固化导电胶作为新型电子连接材料，具有环保、节能等优点。导电胶中基体胶的固化性能是影响导电胶使用可靠性的重要因素。利用实时红外分析研究环氧树脂基体胶的固化过程和固化过程的动力学特征。研究表明基体胶的固化是通过体系中-C=C-双键的互联来实现，随固化反应的进行，双键的相对浓度降低。光引发剂的添加量影响体系的固化速度和固化程度，光引发剂的添加量存在阈值Cmax。

UV Curing Kinetics of a Conductive Adhesive

Act as a new electronic packaging material, the UV curable conductive adhesives have several advantages such as high cure rate, low process temperature, low energy consumption and environmental protection etc. The curing property of adhesive matrix is one of the key factors that determine the performances of conductive adhesive. In this paper, the curing process and curing kinetics of epoxy resin adhesive were studied by the real time Fourier Transform Infrared (RT-FTIR) Spectroscopy measurement. Experiment results indicated that the curing process was completed through the cross-reaction of -C=C- bonds. The ratio of the bonds decreased as the reaction processing. The cure rate and cure degree were influenced by the amount of photo-initiators, which initiate the curing reaction. There is a threshold value, C max , for the added photoinitiators.