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基于SU-8负胶的微流体器件的制作及研究
引用本文:王彬,陈翔,许宝建,金庆辉,赵建龙,徐元森.基于SU-8负胶的微流体器件的制作及研究[J].功能材料与器件学报,2006,12(3):215-219.
作者姓名:王彬  陈翔  许宝建  金庆辉  赵建龙  徐元森
作者单位:中国科学院上海微系统与信息技术研究所,上海,200050
基金项目:上海市AM基金 , 上海市纳米科技专项基金
摘    要:采用SU-8结构释放并键合玻片制作了多层结构的微流体芯片,探讨了影响芯片气密性和沟道堵塞的因素,并通过荧光显示验证,提供了一种快速、低成本的塑性微流体器件制作方法.

关 键 词:微流体器件  结构释放  SU-8键合  塑性
文章编号:1007-4252(2006)03-0215-05
收稿时间:2005-07-01
修稿时间:2005-07-012005-09-28

Fabrication and study of microfluidic devices using SU- 8
WANG Bin,CHEN Xiang,XU Bao-jian,JIN Qing-hui,ZHAO Jian-long,XU Yuan-sen.Fabrication and study of microfluidic devices using SU- 8[J].Journal of Functional Materials and Devices,2006,12(3):215-219.
Authors:WANG Bin  CHEN Xiang  XU Bao-jian  JIN Qing-hui  ZHAO Jian-long  XU Yuan-sen
Affiliation:Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China
Abstract:Based on SU -8 structural releasing and bonding with glass substrate, microfluidic chips with multilayered structure were fabricated. Various factors concerning the gas tightness and blocking of the channels were studied. Based on on - chip fluorescent illustration as on - line test, a rapid fabrication method of plastic microfluidic devices at low cost is presented.
Keywords:microfluidic device  structural releasing  SU - 8 bonding  plastic
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