| PCB检查的声学工具及其应用 |
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| 引用本文： | 杨建生,陈建军.PCB检查的声学工具及其应用[J].电子质量,2004(2):37-38. |
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| 作者姓名： | 杨建生 陈建军 |
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| 作者单位： | 天水华天微电子有限公司;天水华天微电子有限公司 |
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| 摘 要： | 随着电子封装技术不断朝着微型化的发展,在检查倒装芯片封装和芯片规模封装中,声学微成像技术得到了极大的应用.利用扫描探测器把超声波用脉冲输入倒装芯片或别的封装,超声波在封装中向下穿透,直至遇到两种不同材料之间的界面为止.
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| 关 键 词： | 声学微成像技术 无塑流下填充物检查 散热片粘附层测量 |
Acoustic Tools and Applications for PCB Inspection |
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| Yang Jiansheng Chen Jianjun TianShuiHuaTian Microelectronics Co.,LTD.Acoustic Tools and Applications for PCB Inspection[J].Electronics Quality,2004(2):37-38. |
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| Authors: | Yang Jiansheng Chen Jianjun TianShuiHuaTian Microelectronics Co LTD |
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| Abstract: | Because of the compact design of flip chips and CSPs in electronic packaging , acoustic microimaging has become extremely important for inspecting these packages .When ultrasound is pulsed into a flip chip or other packages by the scanning transducer ,it travels downward into the package until it encounters the interface between two dissimilar materials . |
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| Keywords: | Acoustic Microimaging Cross-sectional view! No-flow Underfill Adhesive Measurements for Heat Sinks |
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