| Affiliation: | 1. State Key Lab of ASIC and System, Department of Microelectronics, Fudan University, Shanghai 200433, China;2. Micro and Nanotechnology Centre, Rutherford Appleton Laboratory, STFC, Didcot, Oxon OX11 0QX, UK;1. School of Electronic Information Engineering, Tianjin University, 92 Weijin road, Tianjin city 300072, China;2. Key Laboratory for Advanced Ceramics and Machining Technology,Ministry of Education, School of Materials Science and Engineering, Tianjin University, 92 Weijin road, Tianjin city 300072, China;1. School of Microelectronics, Tianjin University, Tianjin 300072, China;2. Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin University, Tianjin 300072, China;3. Key Laboratory for Advanced Ceramics and Machining Technology, Ministry of Education, School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China;1. The Research Institute of Industrial Science, Hanyang University, Seoul, 133-791, Republic of Korea;2. Division of Materials Science and Engineering, Hanyang Uniersity, Seoul, 04763, Republic of Korea;3. Department of Materials and Metallurgical Engineering, Kangwon National University, 346 Joongang-ro, Samcheok, Gangwon-do 25913, Republic of Korea;4. Department of Materials Science and Engineering, Inha University, Incheon, 402-751, Republic of Korea |
