Cu-W、Cu-Mo薄膜的微观结构及显微硬度分析

采用磁控共溅射方法分别制备了含有W和Mo两种不同成分的铜系薄膜，用EDX、XRD、SEM和纳米压痕仪对薄膜成份、结构、形貌和显微硬度进行了分析。结果表明，制备出的Cu—W和Cu-Mo薄膜均呈晶态结构，Cu-W和Cu—Mo形成了均匀的固溶体；经650℃热处理1h后，Cu—W和Cu—Mo薄膜中晶粒长大，有富w和富Mo相从基体Cu相中弥散析出；Cu-W薄膜的显微硬度随W成分的增加先增加后降低；Cu—Mo薄膜的显微硬度随Mo成分的增加而持续升高，薄膜退火态的显微硬度低于沉积态。分析认为，以上结果的产生均因添加W、Mo所引起的晶粒细化效应和薄膜的热稳定性较差所致。

Analysis on Microstructure and Microhardness of Cu -W, Cu -Mo Thin Film

The two kinds of copper thin films with W or Mo are prepared by magnetron co - sputtering method, the composition, structure, morphology and microhardness of thin films is analyzed by EDX, XRD, SEM and nanometer indentation testers. The results show that the prepared Cu-W and Cu-Mo thin film all present crystalline state structure, Cu-W and Cu-Mo forms uniform solid solution; the grains in Cu-W and Cu-Mo thin film grow up after the heat treatment for one hour at 650~C , there is enriched W and Mo phase precipitated dispersively from the host Cu phase; the microhardness of Cu-W thin film is increased and then decreased along with the increasing of W; the microhardness of Cu-Mo thin fihn constantly rise along with the increasing of Mo, the microhardness of annealed thin film is lower than as-deposited thin film. The analysis show that the reasons for the above results are caused by addition of W, Mo, which leads to grain refine- ment effect and poor thermal stability of the thin fihn.