高导热金刚石/铜复合材料的导热研究进展

金刚石/铜复合材料具有密度低、热导率高及热膨胀系数可调等优点,且与新一代芯片具有良好的热匹配性能,因此其在高热流密度电子封装领域具有非常广泛的应用前景。然而由于金刚石与铜界面润湿性差,界面热阻高,导致材料热导率比铜还低,限制了其应用。为了改善其界面润湿性,国内外通过在金刚石表面金属化或对铜基体预合金化等手段来修饰复合材料界面,以提高金刚石/铜复合材料的热导率。本文综述了表面改性、导热模型相关的界面理论以及有限元模拟的研究进展,讨论了制备工艺、导热模型和未来发展的关键方向,总结了金刚石添加量、颗粒尺寸等制备参数对其微观组织结构和导热性能的影响规律。

Progress in Heat conduction of Diamond/Cu Composites with High thermal conductivity

Diamond/Cu composites have advantages of low density, high thermal conductivity and tailorable coefficient of thermal expansion (CTE), and possess a good thermal matching performance with new generation chips. Therefore, it has a widespread application prospect in electronic packaging with high heat flux density and other fields. However, due to the poor wettability between diamond and Cu as well as high interfacial thermal resistance, bringing about the conductivity of composite is even lower than copper, which restricts its application. The interface of composite is modified to transform their mechanical and physical bonding state into a chemical and metallurgical bonding by pre-metallization, pre-alloying copper matrix and optimization of composite processing so as to improve wettability at home and abroad nowadays. In this paper, surface modification, interface theory related to thermal conducting model and research development in finite element simulation are reviewed. The difficulties of fabricated process, thermal conducting models, and key direction of future development are discussed. The effects of parameters such as diamond content and particle size on microstructure and thermal conducting performance are summarized.