| 低放热室温固化环氧胶粘剂的制备及其性能研究 |
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| 引用本文： | 钟震,任天斌,黄超. 低放热室温固化环氧胶粘剂的制备及其性能研究[J]. 热固性树脂, 2011, 0(3): 29-31,35 |
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| 作者姓名： | 钟震 任天斌 黄超 |
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| 作者单位： | 同济大学材料科学与工程学院; |
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| 摘 要： | 在聚硫醇固化剂中加入巯基乙酸制备出低放热的双组分室温固化环氧胶粘剂,探讨了E-44、E-51以及A l(OH)3的加入量对A组分粘度的影响,测试了加入不同促进剂时环氧胶粘剂的性能,研究了DMP-30加入量对胶体热性能的影响,考察了巯基乙酸的用量对胶粘剂耐水性的影响。结果表明,DMP-30的质量分数为10%时,热变形温度最佳,加入巯基乙酸后,环氧胶的耐水性提高显著,当巯基乙酸的质量分数为2%时,环氧胶粘剂的放热峰为80.1℃,凝胶时间为27~30 min,拉伸剪切强度为24.2 MPa。
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| 关 键 词： | 巯基乙酸 低放热 室温固化 环氧胶粘剂 制备 耐水性 |
Preparation and property study of low exothermic room temperature curing epoxy adhesive |
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| ZHONG Zhen,REN Tian-bin,HUANG Chao(School of Material Science , Engineering,Tongji University,Shanghai ,China. Preparation and property study of low exothermic room temperature curing epoxy adhesive[J]. Thermosetting Resin, 2011, 0(3): 29-31,35 |
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| Authors: | ZHONG Zhen REN Tian-bin HUANG Chao(School of Material Science Engineering Tongji University Shanghai China |
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| Affiliation: | ZHONG Zhen,REN Tian-bin,HUANG Chao(School of Material Science and Engineering,Tongji University,Shanghai 200092,China |
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| Abstract: | Low exothermic room temperature curing epoxy adhesive was prepared by adding mercaptoacetic acid to mercaptan terminated liquid curing agent system.The influence of E-44,E-51 and Al(OH3 contents on the viscosity of part-A was studied and the properties of adhesive with different accelerators were tested.The effect of DMP-30 contents on thermal properties of adhesive was investigated and the water resistance of adhesive with different amount of mercaptoacetic acid were discussed.The results showed that the h... |
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| Keywords: | mercaptoacetic acid low exotherm room temperature curing epoxy adhesive preparation water resistance |
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