蓝宝石衬底双面研磨亚表面损伤分布研究

在前人对硬脆性材料亚表面损伤预测理论研究的基础上,建立了蓝宝石衬底双面研磨亚表面损伤层深度与表面划痕深度之间的理论模型(DNR)。通过对双面研磨后的衬底晶片进行KOH轻度化学腐蚀并结合VK-X100/X200形状测量激光显微系统,得到了晶片表面划痕随深度的分布情况,进而得出了晶片亚表面损伤层随深度的分布情况。研究表明：亚表面损伤层随深度变化的分布规律为随着深度的增大呈递减趋势,集中分布在距离外层碎裂及划痕破坏层下方0～12.9μm深度范围内,所占比例达96.7%左右。研究结果有利于优化双面研磨工艺参数来控制亚表面损伤层的深度。

Study on Distribution of Subsurface Damage on Sapphire Substrate after Two-sided Lapping

According to prediction theory of subsurface damage layer of hard and brittle materials suggested by other scholars, a model that described the relation between the depth of subsurface damage layer and surface scratch was built. KOH(potassium hydroxide) was used to corrode sapphire substrate processed by two-sided lapping and then monitoring with shape measurement laser microscopy system of VK-X100/X200, thus the distribution of surface scratch could be obtained and the distribution of subsurface damage layer could be predicted. Research results show that the subsurface damage layer decreases as the depth increases and the most of them occurs in the depth of 0～12.9μm below the scratch, the percentage is about 96.7%. The results can help researchers to optimize processing parameters of two-sided lapping to lessen the depth of subsurface damage layer.