| 采用热压焊工艺实现金凸点芯片的倒装焊接 |
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| 引用本文： | 张彩云,霍灼琴,高敏,张晨曦.采用热压焊工艺实现金凸点芯片的倒装焊接[J].电子工艺技术,2008,29(1):28-29,32. |
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| 作者姓名： | 张彩云 霍灼琴 高敏 张晨曦 |
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| 作者单位： | 中国电子科技集团公司第二研究所,山西,太原,030024 |
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| 摘 要： | 金凸点芯片的倒装焊接是一种先进的封装技术.叙述了钉头金凸点硅芯片在高密度薄膜陶瓷基板上的热压倒装焊接工艺方法,通过设定焊接参数达到所期望的最大剪切力,分析研究互连焊点的电性能和焊接缺陷,实现了热压倒装焊工艺的优化.同时,还简要介绍了芯片钉头金凸点的制作工艺.
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| 关 键 词： | 倒装焊 热压焊 金凸点芯片 薄膜基板 |
| 文章编号： | 1001-3474（2008）01-0028-03 |
| 收稿时间： | 2007-10-09 |
| 修稿时间： | 2007年10月9日 |
Assembly of Flip Chip Gold Bumps With Thermo-compression Bonding Process |
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| ZHANG Cai-yun,HUO Zhuo-qin,GAO Min,ZHANG Chen-xi.Assembly of Flip Chip Gold Bumps With Thermo-compression Bonding Process[J].Electronics Process Technology,2008,29(1):28-29,32. |
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| Authors: | ZHANG Cai-yun HUO Zhuo-qin GAO Min ZHANG Chen-xi |
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| Affiliation: | ZHANG Cai-yun,HUO Zhuo-qin,GAO Min,ZHANG Chen-xi(CETC No.2 Research Institute,Taiyuan 030024,China |
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| Abstract: | Assembly of flip chip gold bumps is an advanced electronic packaging technology. Describe the assembly of Si chips bumped Au studs on high density thick film ceramic substrates with thermo - compression bonding. In order to optimize the thermo - compression bonding process, the bonding parameters were optimized with respect to the maximum shear strength,electrical quality of the interconnec- tion and possible defects on chip were investigated. Simultaneity introduce the bumping technology of Au studs of chips. |
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| Keywords: | Flip Chip assembly Thermo - compression bonding Gold bumps Thick film substrates |
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