| PTFE埋电阻多层印制板制造技术 |
| |
| 引用本文： | 赖涵琦,彭勤卫.PTFE埋电阻多层印制板制造技术[J].印制电路信息,2010(Z1):225-231. |
| |
| 作者姓名： | 赖涵琦 彭勤卫 |
| |
| 作者单位： | 深南电路有限公司 |
| |
| 摘 要： | 随着电子产品技术的发展,无源器件集成技术与聚四氟乙烯(PTFE)材料在多层印制电路板制造中扮演着越为重要的角色。论文在无源器件集成技术之一的薄膜埋电阻技术的基础上对PTFE埋薄膜电阻多层印制板制造工艺过程进行了讨论。
|
| 关 键 词： | 薄膜电阻 电路板 聚四氟乙烯 多层板 无源器件 |
The process technology of PTFE-based step laminated buried resistant Multilayer printed circuit board |
| |
| LAI Han-qi,PENG Qin-wei.The process technology of PTFE-based step laminated buried resistant Multilayer printed circuit board[J].Printed Circuit Information,2010(Z1):225-231. |
| |
| Authors: | LAI Han-qi PENG Qin-wei |
| |
| Affiliation: | LAI Han-qi PENG Qin-wei |
| |
| Abstract: | With the development of the electronic product,embedded passives and reinforced polytetrafluoetylene(PTFE) material have played more important roles in the production of multilayer printed circuit board.This paper discusses the process technology of PTFE-based step laminated buried resistant multilayer PCB on the basis of planar buried resistant PCB process technology. |
| |
| Keywords: | Buried thin film resistor PCB PTFE Multilayer Embedded passives |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
