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微波介质陶瓷材料的低温烧结
引用本文:曾群,霍良,周永恒.微波介质陶瓷材料的低温烧结[J].材料导报,2010,24(9).
作者姓名:曾群  霍良  周永恒
作者单位:华南师范大学信息光电子科技学院,广州,510006;华南师范大学信息光电子科技学院,广州,510006;华南师范大学信息光电子科技学院,广州,510006
基金项目:华南师范大学学术骨干与团队培养基金,"211"三期建设基金 
摘    要:低温共烧陶瓷材料是目前微波介质材料发展的主流.综述了低温共烧陶瓷材料的性能要求和4种降低材料烧结温度的方法,并探讨了各种低温烧结途径的优点和不足,同时指出了目前低温共烧陶瓷材料研究中需解决的主要问题以及今后主要的发展方向.

关 键 词:微波介质陶瓷  低温共烧  固有烧结温度

Low-temperature Firing in Microwave Dielectric Ceramic Materials
ZENG Qun,HUO Liang,ZHOU Yongheng.Low-temperature Firing in Microwave Dielectric Ceramic Materials[J].Materials Review,2010,24(9).
Authors:ZENG Qun  HUO Liang  ZHOU Yongheng
Abstract:The low temperature co-fired ceramic materials are the mainstream of the development of microwave dielectric ceramics.In this paper,the performance requests for low-temperature co-fired ceramics,four ways to de-crease the sintering temperatures are described.In addition,the advantages and disadvantages of each way to lower the sintering temperature are discussed.Also,the main problems and the development direction about the investiga-tion of the low-temperature co-fired ceramics are indicated in this paper.
Keywords:microwave dielectric ceramic  low-temperature co-firing  intrinsic sintering temperature
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