Temperature measurement at flip chip solder joint during electromigration test |
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Authors: | Kimihiro Yamanaka Takafumi Ooyoshi Takayuki Nejime |
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Affiliation: | (1) Advanced Packaging Laboratory, KYOCERA SLC Technologies Corporation, 656 Ichimiyake, Yasu Shiga, 520-2362, Japan |
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Abstract: | Measuring the real temperature of a flip chip solder joint during an electromigration test has been a problem because of its
small size and the local Joule heating due to a large applied current. A unique method that employs the electrical resistance
change in the junction line between two solder joints was introduced to determine the temperature of the solder joint. The
change in resistance was converted into temperature using a thermal coefficient of resistance of the junction line. The method
accurately measured temperatures of the solder joint within 2 K until the solder joint resistance change ratio reached 100%
due to growth of an electromigration void. |
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Keywords: | |
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