| Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys |
| |
| 作者姓名： | 赵小艳 赵麦群 崔小清 许天旱 仝明信 |
| |
| 作者单位： | School of Materials Science and Engineering, Xi＇an University of Technology, Xi＇an 710048, China |
| |
| 基金项目： | 山西省国家重点基础研究发展规划(973计划) |
| |
| 摘 要： | The melting point, spreading property, mechanical properties and microstructures of Sn-3.0Ag-2.8Cu solder alloys added with micro-variable-Ce were studied by means of optical microscopy, scanning electron microscopy（SEM） and energy dispersive X-ray（EDX）. The results indicate that the melting point of Sn-3.0Ag-2.8Cu solder is enhanced by Ce addition; a small amount of Ce will remarkably prolong the creep-rupture life of Sn-3.0Ag-2.8Cu solder joint at room temperature, especially when the content of Ce is 0.1%, the creep-rupture life will be 9 times or more than that of the solder joint without Ce addition; the elongation of Sn-3.0Ag-2.SCu solder is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1%.
|
| 关 键 词： | 铈 微观结构 机械性能 锡银铜合金 无铅焊料 |
| 收稿时间： | 31 August 2006 |
| 修稿时间： | 2006-08-312007-04-02 |
Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys |
| |
| ZHAO Xiao-yan,ZHAO Mai-qun,CUI Xiao-qing,XU Tian-han,TONG Ming-xin.Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys[J].Transactions of Nonferrous Metals Society of China,2007,17(4):805-810. |
| |
| Authors: | ZHAO Xiao-yan ZHAO Mai-qun CUI Xiao-qing XU Tian-han TONG Ming-xin |
| |
| Affiliation: | School of Materials Science and Engineering, Xi''an University of Technology, Xi''an 710048, China |
| |
| Abstract: | The melting point, spreading property, mechanical properties and microstructures of Sn-3.0Ag-2.8Cu solder alloys added with micro-variable-Ce were studied by means of optical microscopy, scanning electron microscopy(SEM) and energy dispersive X-ray(EDX). The results indicate that the melting point of Sn-3.0Ag-2.8Cu solder is enhanced by Ce addition; a small amount of Ce will remarkably prolong the creep-tupture life of Sn-3.0Ag-2.8Cu solder joint at room temperature, especially when the content of Ce is 0.1%, the creep-rupture life will be 9 times or more than that of the solder joint without Ce addition; the elongation of Sn-3.0Ag-2.gCu solder is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1%. |
| |
| Keywords: | Sn-Ag-Cu system lead-free solder alloy melting point spreading property mechanical property |
| 本文献已被 维普 万方数据 ScienceDirect 等数据库收录！ |
