| 焊膏配用焊剂的研制 |
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| 引用本文： | 肖尚明. 焊膏配用焊剂的研制[J]. 电子工艺技术, 1998, 19(2): 58-59,63 |
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| 作者姓名： | 肖尚明 |
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| 作者单位： | 电子工业部第三十八研究所 |
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| 摘 要： | 详细介绍了一种焊膏配用焊剂的研制过程，主要介绍焊剂体系的各种组份及其对焊剂和烛地膏性能的影响。
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| 关 键 词： | 焊膏 焊剂 活化剂 焊剂活性 |
Development of Flux for Soldering Paste |
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| Xiao Shangming. Development of Flux for Soldering Paste[J]. Electronics Process Technology, 1998, 19(2): 58-59,63 |
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| Authors: | Xiao Shangming |
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| Affiliation: | Xiao Shangming |
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| Abstract: | This article introduces a flux suited for solder cream in full details,analysis all the ingredients of this flux and its effect to the flux and solder cream,this flux can be mixed with the low melting point alloy powder such as Si-Pb-Bi or Si-Pb-In to formulate a solder cream which can be used in low temperature reflow soldering or it can be mixed with the Si-Pb alloy-powder to formulate a general solder cream. |
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| Keywords: | Solder cream Flux Activator Activating of flux |
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