| 纳米焦点X射线管和纳米CT检测集成电路封装中的微型互联(英文) |
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| 作者单位： | Zhenhui He,Quan Wen(GE Sensing & Inspection Technologies,phoenix|x-ray,Wunstorf,Germany);Xiaojie Huang(GE Sensing & Inspection Technologies,phoenix|x-ray,Shanghai,China)
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| 摘 要： | IC封装中嵌入的微型电路连接可以通过纳米焦点X光光管技术和纳米焦点CT来检测;包括铜或金焊线、堆叠芯片、倒装焊接、微穿孔连接的封装形式。生动地描述了2维3维X射线影像技术,并且呈现了亚微米分辨率的各种分析结果和缺陷案例。
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| 关 键 词： | 对准系统 步进光刻机 对准方式 对准模型 |
Inspection of Miniaturised Interconnections in IC Packages with Nanofocus X-ray tubes and nanoCT |
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| Authors: | Zhenhui He Quan Wen Xiaojie Huang |
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| Affiliation: | 1. GE Sensing & Inspection Technologies,phoenix|x-ray,Wunstorf,Germany
2. GE Sensing & Inspection Technologies,phoenix|x-ray,Shanghai,China |
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| Abstract: | Miniaturised and concealed electrical interconnections in IC packages including copper and gold wire bonds, stack dies, flip chips and microvias were inspected by nanofocus X-ray tube technology and nanofocus computed tomography. The 2D and 3D X-ray imaging technology is concisely described and various analysis results and defect examples at sub-micrometer resolution are presented. |
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| Keywords: | IC package X-ray tubes nano CT failure analysis |
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