| 电流密度对熔融盐电沉积金属钨镀层性能的影响 |
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| 引用本文： | 刘艳红,张迎春,刘其宗,李旭亮,江凡,葛昌纯.电流密度对熔融盐电沉积金属钨镀层性能的影响[J].电镀与涂饰,2012,31(5):1-5. |
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| 作者姓名： | 刘艳红 张迎春 刘其宗 李旭亮 江凡 葛昌纯 |
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| 作者单位： | 北京科技大学,北京,100086 |
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| 基金项目： | 国际热核聚变实验堆(ITER)计划专项，国家自然科学基金 |
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| 摘 要： | 采用二元熔盐氧化物Na2WO4和WO3,以脉冲电沉积的方法在占空比0.5、脉冲频率1000Hz、电沉积温度850°C的条件下,于热沉材料CuCrZr之上获得了金属钨镀层。讨论了电流密度对钨镀层微观结构、显微硬度、结合强度等性能的影响。当电流密度为20～30mA/cm2时,能够获得表面致密均匀的钨镀层。随着电流密度的增大,电流效率呈现先增大后下降的趋势,当电流密度为30mA/cm2时,电流效率达到最大值92.64%。
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| 关 键 词： | 铜-铬-锆合金 钨 熔盐 电沉积 电流密度 微观结构 电流效率 |
Effect of current density on properties of tungsten coating electrodeposited from molten salt |
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| LIU Yan-hong
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ZHANG Ying-chun
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LIU Qi-zong
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LI Xu-liang
,
JIANG Fan
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GE Chang-chun.Effect of current density on properties of tungsten coating electrodeposited from molten salt[J].Electroplating & Finishing,2012,31(5):1-5. |
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| Authors: | LIU Yan-hong ZHANG Ying-chun LIU Qi-zong LI Xu-liang JIANG Fan GE Chang-chun |
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| Affiliation: | University of Science and Technology Beijing,Beijing 100083,China |
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| Abstract: | Metallic tungsten coatings were obtained by pulsed electrodeposition on Cu-Cr-Zr alloy,a heat sink material,from binary molten salt Na 2 WO 4-WO 3 at 850 °C with duty cycle 0.5 and frequency 1 000 Hz.The effect of current density on microstructure,microhardness,and bonding strength were discussed.Uniform and compact tungsten coatings were obtained when the current density varied from 20 mA/cm 2 to 30 mA/cm 2.The current efficiency was increased initially and then decreased with the increasing of current density,and reached the maximum value (92.64%) at 30 mA/cm 2. |
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| Keywords: | copper-chromium-zirconium alloy tungsten molten salt electrodeposition current density microstructure current efficiency |
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