| 玻璃浆料低温气密封装MEMS器件研究 |
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| 引用本文： | 许薇,王玉传,罗乐. 玻璃浆料低温气密封装MEMS器件研究[J]. 功能材料与器件学报, 2005, 11(3): 343-346 |
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| 作者姓名： | 许薇 王玉传 罗乐 |
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| 作者单位： | 中国科学院上海微系统与信息技术研究所,上海200050;中国科学院研究生院,北京100039;中国科学院上海微系统与信息技术研究所,上海200050 |
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| 摘 要： | 系统地研究了玻璃浆料在低温下气密封装MEMS器件的过程。采用该工艺（预烧结温度400℃，烧结温度500℃，外加压强3kPa）形成的封装结构具有较高的封接强度（剪切力〉15kg）及良好的气密性（气密检测合格率达到85％），测得的漏率符合相关标准。
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| 关 键 词： | 玻璃浆料 圆片级键合 低温气密封装 |
| 文章编号： | 1007-4252（2005）03-0343-04 |
| 收稿时间： | 2004-11-12 |
| 修稿时间： | 2005-03-02 |
Wafer-level hermetic package of MEMS by glass solder at low temperature |
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| XU Wei,WANG Yu-chuan,LUO Le. Wafer-level hermetic package of MEMS by glass solder at low temperature[J]. Journal of Functional Materials and Devices, 2005, 11(3): 343-346 |
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| Authors: | XU Wei WANG Yu-chuan LUO Le |
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| Abstract: | Hermetic package is necessary for MEMS devices because they are very sensitive to the environment, such as stress, dust, humidity, gas flow, temperature and so on. A low-temperature waferlevel encapsulation technique was presented to hermetically sealed MEMS devices. A cap wafer is bonded to the device wafer using a pre-solidified frit glass as a bonding medium Such that the devices are hermetically sealed inside the cavities. Shear and leakage test were performed to investigate the bonding strength of the sealing structure and the hermeticity of the encapsulation. The results prove that the leakage fulfill the corresponding MIL-STD. |
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| Keywords: | glass frit wafer-level low-temperature hermetic package |
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