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Study on initiation of localised corrosion on copper thin film electrode by combinational use of an EQCM with a liquid-phase ion gun
Authors:Fredrik Falkenberg
Affiliation:Graduate School of Engineering, Hokkaido University, Kita-13 Jo, Nishi-8 Chome, Kita-ku, Sapporo 060-8628, Japan
Abstract:A new method allowing simultaneous measurements of anodic currents and small mass changes during initiation and early growth of a single localised corrosion site was discussed. An electrochemical quartz crystal microbalance (EQCM) was combined with a liquid-phase ion gun consisting of an Ag/AgCl microelectrode which produces chloride ions, causing local breakdown of passive film and pit growth. The method was applied to copper thin films polarised anodically at 0.6 or 0.8 V (SHE) in pH 8.4 borate buffer solution. It was found from comparison between coulometry and gravimetry that copper dissolves as Cu2+ during the pit growth. The shape of the pit was almost circular and the average pit current density, ip=25 A cm−2 was evaluated from the kinetics of 2D pit growth.
Keywords:A  Copper  B  Polarization  C  Electrodeposited films  C  Passive films  C  Pitting corrosion
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