| 超高亮度发光二极管芯片切割技术 |
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| 引用本文： | 钟继.超高亮度发光二极管芯片切割技术[J].半导体技术,2007,32(7):606-609. |
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| 作者姓名： | 钟继 |
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| 作者单位： | 厦门出入境检验检疫局,福建,厦门,361022 |
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| 摘 要： | 介绍了超高亮度发光二极管(UHB-LED)芯片切割工艺中砂轮切割、金刚刀划片及激光切割的应用情况、工艺原理、工艺特点和发展前景.结合生产实践,对比和分析了不同切割工艺的优缺点,针对不同切割生产工艺中存在的芯片正崩、芯片背崩、芯片脱落以及划片裂片不良等问题进行了探讨并提出了解决方法.指出激光切割技术是LED芯片切割工艺发展的必然趋势.
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| 关 键 词： | 超高亮度发光二极管 芯片 切割 |
| 文章编号： | 1003-353X（2007）07-0606-04 |
| 修稿时间： | 2007-01-07 |
Dicing Saw and Scriber Technology for UHB-LED Chip Process |
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| ZHONG Ji.Dicing Saw and Scriber Technology for UHB-LED Chip Process[J].Semiconductor Technology,2007,32(7):606-609. |
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| Authors: | ZHONG Ji |
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| Affiliation: | Xiamen Exlt-Entry Inspection and Quarantine Bureau, Xiamen 361022, China |
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| Abstract: | The principle,applications,characteristics and prospects of dicing saw,diamond scriber and laser scriber technology for UHB-LED chip manufacturing process were presented.The main advantages and shortcomings of those technologies were also compared and analyzed.The methods how to solve processing problems such as chip lost out,chip collapse and scribe failure were subjected.It points out that laser technology is the key way to develop UHB-LED chip scribing process. |
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| Keywords: | UHB-LED chip dicing saw |
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