| 微电子器件塑封损伤机理分析 |
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| 引用本文： | 王长河.微电子器件塑封损伤机理分析[J].微纳电子技术,2000(2). |
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| 作者姓名： | 王长河 |
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| 作者单位： | 电子十三所!石家庄050051 |
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| 摘 要： | 分析了塑封微电子器件的失效模式及损伤机理 ,在此基础上讨论了提高塑封器件可靠性的对策及应用前景。
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| 关 键 词： | 可靠性 失效模式 损伤机理 |
Damage Mechanism Analysis for Plastic Encapsulated Microelectronics Devices |
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| Wang Changhe.Damage Mechanism Analysis for Plastic Encapsulated Microelectronics Devices[J].Micronanoelectronic Technology,2000(2). |
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| Authors: | Wang Changhe |
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| Abstract: | The failure model and damage mechanism of plastic encapsulated microelectronics devices are analyzed in this paper.And then the countermeasure for improving reliability of devices and its future are discussed. |
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| Keywords: | Reliability Failure model Damage mechanism |
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