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| 聚酰亚胺表面化学沉铜前处理的微观分析 | |
| 引用本文： | 胡光辉,李大树,蒙继龙.聚酰亚胺表面化学沉铜前处理的微观分析[J].印制电路信息,2006(5):40-42. |
| 作者姓名： | 胡光辉 李大树 蒙继龙 |
| 作者单位： | 1. 安捷利(番禺)电子实业有限公司;华南理工大学机械工程学院 2. 安捷利(番禺)电子实业有限公司 3. 华南理工大学机械工程学院 |
| 摘 要： | 讨论了聚酰亚胺(PI)沉铜前处理过程对孔内沉铜空洞的可能影响,利用扫描电子显微镜分析了每道前处理后PI的微观表面状态。实验表明,只有当PI表面被PI调整剂粗化后方可以提高沉铜层与PI之间的结合力,而且沉铜层与PI间的结合力还与沉铜时间相关。 |
| 关 键 词： | 聚酰亚胺 化学沉铜 前处理 |
Microanalysis of the Surface of Polyimide after each Pretreatment before Electroless Copper Plating |
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| Hu Guanghui,Li Dashu,Meng Jilong.Microanalysis of the Surface of Polyimide after each Pretreatment before Electroless Copper Plating[J].Printed Circuit Information,2006(5):40-42. | |
| Authors: | Hu Guanghui Li Dashu Meng Jilong |
| Affiliation: | Hu Guanghui Li Dashu Meng Jilong |
| Abstract: | This paper discusses the probable effect of the pretreatment of polyimide on the empty copper in thehole. And scanning electronic microscope was used to analyze the microstructure of polyimide after each pretreatment.The results indicate that only when polyimide was made coarse, the binding between copper deposit and polyimidecould be enhanced. And the binding is also related to deposition time. |
| Keywords: | polyimide electroless copper plating pretreatment |
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