高热流密度电子元件中热管散热技术的进展

散热器的散热性能是影响电子元件使用寿命与安全性的重要因素,热管以其空间尺寸小、冷却能力高、无需消耗动力等优点在高热流密度元件的散热技术领域得到广泛应用.文中总结了热管散热器整体结构设计的创新尤其是热管的不同排布和组合,研究了热管元件性能的提高包括热管内部吸液芯的改进、复杂结构吸液芯的制造,分析了纳米流体工质的引入对换热效果的强化,介绍了散热器热性能分析和参数优化的相关方法.通过分析总结国内外研究成果,提出了新概念热管散热器的结构设计、纳米流体理论模型及复合吸液芯的加工制造等方面的发展趋势与展望.

Development of heat pipe cooling technology in high heat flux electronic components

Cooling performance of tradiator is an important factor affecting service life of electronic component and security. Heat pipe is widely used in high heat flux electronic components because of its small size,high cooling capacity and no consumption of power. The overall structure innovations of heat pipe radiator,particularly different arrangements and combinations of heat pipe are summarized,and thermal performance enhancements of heat pipe,including improvement of internal wick structure,complex internal wick structure manufacture are studied. The introduction of nano-fluid for heat transfer improvement is analyzed,and the relevant methods of heat sink thermal performance analysis and parameter optimization are introduced. The development trends and prospects of new structural design concept of heat pipe radiator,nano-fluid model and manufacture of compound liquid-absorbing core are proposed according to analyzing and summarizing research achievements.