基于SIwave的设备级辐射发射仿真分析

针对自制红外报警设备的近场辐射发射特性问题,提出了利用SIwave-Designer-HFSS三种模块对该设备的电源PCB、报警器PCB、机箱外壳三部分模型进行场路协同仿真的分析方法,并通过PCB板近场分布及观测点处场强的仿真与实测结果对比证实了该方法的可行性。基于SIwave的设备级辐射发射协同仿真方法是一种通用方法,适用于包含多块PCB及外壳的电子设备辐射发射特性的仿真分析。

Simulation Analysis of Device Level Radiation Emission Based on SIwave

Aiming at the near-field radiation emission characteristics of self-made infrared alarm equipment,an analysis method of field-circuit co-simulation of the power supply PCB,alarm PCB,and chassis shell of the device using three modules of SIwave-Designer-HFSS was proposed,The feasibility of this method is confirmed by comparing the simulation results of near-field distribution of PCB and field strength at observation point with the actual measurement results.The SIwave-based co-simulation method for device level radiation emission is a general method that is suitable for simulation analysis of radiation emission characteristics of electronic devices including multiple PCBs and shells.