| Sn-Zn系钎料专用助焊剂 |
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| 引用本文： | 韩若男,薛松柏,胡玉华,王宗阳,贾建漪. Sn-Zn系钎料专用助焊剂[J]. 焊接学报, 2012, 33(10): 101-104 |
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| 作者姓名： | 韩若男 薛松柏 胡玉华 王宗阳 贾建漪 |
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| 作者单位： | 1. 南京航空航天大学材料科学与技术学院,南京,210016
2. 中国电子科技集团第五十五研究所,南京,210016 |
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| 摘 要： | 采用铺展试验法研究了Sn-9Zn钎料配合自制Sn—Zn系钎料专用助焊剂、NH4Cl-ZnCl2助焊剂、树脂型助焊剂以及水溶性助焊剂在铜板上的铺展能力。结果表明，使用自制助焊剂A。匹配Sn-9Zn钎料铺展性能相比其它助焊剂铺展面积明显增大．自制助焊剂不含卤素，钎料的铺展面积最大为65．7mm2，相比NH4C1-ZnCl2助焊剂、树脂型助焊剂、水溶性助焊剂分别提高了16．1％，116．1％，85．1％．此外，复配助焊剂能进一步促进钎料在铜板上的铺展，最大铺展面积分别达到76．5，72．5mm2，控制磺酸亚锡的含量为20％（质量分数），二乙醇胺，丁二酸的最佳添加量依次为8％，10％（质量分数）．
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| 关 键 词： | Sn—Zn 助焊剂 铺展面积 |
| 收稿时间： | 2011-05-15 |
Development of flux for Sn-Zn lead-free solder |
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| HAN Ruonan,XUE Songbai,HU Yuhu,WANG Zongyang and JA Jianyi. Development of flux for Sn-Zn lead-free solder[J]. Transactions of The China Welding Institution, 2012, 33(10): 101-104 |
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| Authors: | HAN Ruonan XUE Songbai HU Yuhu WANG Zongyang JA Jianyi |
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| Affiliation: | College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,The 55th Research Institute, China Electronic Technology Group Corporation, Nanjing 210016, China,College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China and College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China |
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| Abstract: | The speadabitity of Sn-9Zn solder on Cu substrate with four different types of flux was studied by spreading experiment method.The experimental results indicated that Sn-9Zn solder, matching the flux-A4 with stannous sulfonate(20%) as the main activator without halogen which exhibited excellent wettability.The largest spreading area was 65.7 mm2, increased respeetively by 16.1%, 116.1%, 85.1% compared with the NH4Cl-ZnCl2, resin and water-solubility fluxes.Besides, the newly developed flux with combination of 20% stannous sulfonate and diethanolamine, succinic acid could remarkably improve the wettabiltiy of Sn-9Zn solder that the largest spreading areas were 76.5 mm2, 72.5 mm2 when the contents of diethanolamine, succinic acid were at 8%, 10%. |
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| Keywords: | Sn-Zn soldering flux spreading areas |
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