| 高冲击下电子线路灌封材料的缓冲机理及措施研究 |
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| 引用本文： | 吴晓莉,张河. 高冲击下电子线路灌封材料的缓冲机理及措施研究[J]. 包装工程, 2004, 25(1): 44-46 |
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| 作者姓名： | 吴晓莉 张河 |
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| 作者单位： | 南京理工大学,江苏,南京,210094;南京理工大学,江苏,南京,210094 |
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| 摘 要： | 从能量吸收和应力波传播两方面研究了高冲击下电子线路灌封材料的缓冲机理及材料的选用准则.对硬目标侵彻引信电路体的缓冲提出了相应的措施,实验证明这些措施是合理有效的.
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| 关 键 词： | 灌封材料 电子线路 抗冲击 |
| 文章编号： | 1001-3563(2004)01-0044-03 |
| 修稿时间： | 2003-07-01 |
The Cushioning Mechanism and Measures of Sealing Materials of Circuit Boards in High-G Impact |
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| WU Xiao-li,ZHANG He. The Cushioning Mechanism and Measures of Sealing Materials of Circuit Boards in High-G Impact[J]. Packaging Engineering, 2004, 25(1): 44-46 |
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| Authors: | WU Xiao-li ZHANG He |
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| Abstract: | The cushioning mechanism and selecting rules of sealing materials were analyzed from energy-absorption and stress wave spread . The corresponding cushioning measures were adviced for the circuit boards of hard target fuze, which were proved to be effective and reasonable by penetration tests. |
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| Keywords: | Sealing material Circuit board Impact resistance |
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