| 小封装二极管的热阻测试 |
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| 引用本文： | 保爱林,邓爱民,傅剑锋,管国栋. 小封装二极管的热阻测试[J]. 半导体技术, 2008, 33(11) |
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| 作者姓名： | 保爱林 邓爱民 傅剑锋 管国栋 |
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| 作者单位： | 绍兴旭昌科技企业有限公司,浙江,绍兴,312000;绍兴旭昌科技企业有限公司,浙江,绍兴,312000;绍兴旭昌科技企业有限公司,浙江,绍兴,312000;绍兴旭昌科技企业有限公司,浙江,绍兴,312000 |
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| 摘 要： | 随着封装体积的减小,半导体分立器件引线的外露部分也越来越小,这给引线温度的测试带来了巨大挑战.以封装外形为SOD-123FL的小电流整流二极管为例,介绍了结到引线的热阻和结到环境的热阻的测试方法.通过测量焊接于引线端部的小尺寸二极管芯片以及被测样品在不同温度下的热敏电压,实现了对小封装器件的引线温度和二极管本身结温的精密测量.
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| 关 键 词： | 热阻 结温 小封装器件 二极管 封装尺寸 |
Thermal Resistance Test of Small Outline Diode |
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| Bao Ailin,Deng Aimin,Fu Jianfeng,Guan Guodong. Thermal Resistance Test of Small Outline Diode[J]. Semiconductor Technology, 2008, 33(11) |
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| Authors: | Bao Ailin Deng Aimin Fu Jianfeng Guan Guodong |
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| Affiliation: | Bao Ailin,Deng Aimin,Fu Jianfeng,Guan Guodong(Shaoxing Rising-Sun Technology Co.Ltd.,Shaoxing 312000,China) |
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| Abstract: | As the reduce of package size,the outer-lead of semiconductor device is getting much more shorter,which lead to the great challenges for the measurement of the lead temperature.A small current rectifier diode(packaging appearance SOD-123FL)was taken as an example to introduce the measuring methods of the thermal resistance both junction to lead terminal and junction to the ambient.By measuring the thermal sensitive voltage under the different temperatures for both the small size of the diode chip(soldered t... |
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| Keywords: | thermal resistance junction temperature small outline device diode package size |
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