| 无氰镀银的工艺与技术现状 |
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| 引用本文： | 刘仁志.无氰镀银的工艺与技术现状[J].电镀与精饰,2006,28(1):21-24. |
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| 作者姓名： | 刘仁志 |
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| 作者单位： | 武汉风帆表面工程有限公司,湖北,武汉,430015 |
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| 摘 要： | 介绍了无氰镀银的发展过程和技术现状。由于表面添加剂技术的进步,使以前开发的工艺中存在的某些工艺或技术问题得到了解决。这些添加剂或者提高了无氰镀银工艺的电流密度,或者提高了光亮度或表面活性,从而使无氰镀银工艺的工业化成为可能。
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| 关 键 词： | 无氰电镀 镀银 工业化 |
| 文章编号： | 1001-3849（2006）01-0021-04 |
| 收稿时间： | 2004-06-04 |
| 修稿时间： | 2004年6月4日 |
Technology and Status Quo of Cyanide-free Silver Plating Technique |
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| LIU Ren-zhi.Technology and Status Quo of Cyanide-free Silver Plating Technique[J].Plating & Finishing,2006,28(1):21-24. |
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| Authors: | LIU Ren-zhi |
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| Affiliation: | Wuhan Fengfan Surface Engineering Co. , Ltd. , Wuhan 430015, China |
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| Abstract: | Development process and status guo of cyanide-free silver plating technology were introduced.Certain technical or technological problems existing in the prior developed technology have been solved due to the advancement in surface additive techniques.These additives either extend the current density range for cyanide-free silver plating or increase the brightness or surface activity of the coatings obtained from cyanide-free silver plating technology.Thus,industrialization of the cyanide-free silver plating technology is promoted. |
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| Keywords: | cyanide-free plating silver plating industrialization |
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