一种基于AlN多层HTCC基板的SiP模块封装设计

为了满足工作频带宽、传输速率高、功耗大、集成度高的要求，开展一种基于AlN多层高温共烧陶瓷（High Temperature Co-fired Ceramic, HTCC）基板的系统级封装（System in Package, SiP）模块封装设计研究。通过设计制作AlN多层HTCC基板、SiP模块封装结构电性能仿真、模块安装结构热力学仿真设计、组装工艺优化等系列研究工作研制出了小型化、轻量化、高集成的SiP模块。环境试验结果表明该模块具有良好的可靠性。该研究结果可为小型化、轻量化、高集成的SiP模块设计研发提供借鉴。

Design of a SiP Module Based on AlN Multilayer HTCC Substrate

Due to requirements of the wideband, high transfer rate, high power consumption and high integration, design of a system in package (SiP) module based on AlN multilayer high temperature co-fired ceramic (HTCC) substrate is studied in this paper. The AlN multilayer HTCC substrate is designed, the SiP module design and simulation are carried out, thermal simulation and analysis of the module assembly structure are conducted and packaging process is optimized. A small, lightweight and highly integrated SiP module is developed finally, which shows good reliability by environmental test. This research result can provide a reference for design of the small, lightweight and highly integrated SiP module.