UV- and thermal-curing behaviors of dual-curable adhesives based on epoxy acrylate oligomers

Dual-curable adhesives were prepared using various epoxy acrylate oligomers, a reactive diluent, photoinitiators, a thermal-curing agent and a filler. The UV- and thermal-curing behaviors of the dual-curable adhesives were investigated using photo-differential scanning calorimetry (photo-DSC), Fourier transform infrared-attenuated total reflection (FTIR-ATR) spectroscopy, and the determination of the gel fraction, pendulum hardness and adhesion strength.The reaction rate and extent of UV curing were found to be strongly dependent on the concentration of CC bonds in the epoxy acrylate oligomers. The FTIR-ATR absorption peak areas representing the relative concentration of CC bonds in the epoxy acrylate oligomers and trifunctional monomer decreased with increase in UV dose because of photopolymerization. When the dual-curable adhesives were irradiated with UV light, the gel fraction increased with increase in CC bond contents in the epoxy acrylate oligomers. Also, after thermal curing, the gel fraction was highly enhanced due to the cross-linking reaction of the unreacted glycidyl groups in epoxy acrylate oligomers induced by the thermal-curing agent. This cross-linked structure of the dual-curable adhesives affects the pendulum hardness and adhesion strength.