Sn-Ag系电子无铅软钎料的超电势研究

随着微电子表面组装技术（SMT）的迅速发展和公众环境意识的增强，无铅软钎料成为近年来研究的焦点。主要研究了Sn-Ag系合金钎料的超电势电化学性能，并且与传统的Sn-Pb近共晶合金进行了对比。试验证明在酸、碱两种不同的溶液环境中，无铅软钎料在Sn-Pb合金的超电势有明显的差异。并指出含铋的钎料的超电势随着铋的含量的增加而降低，从而提出了在无铅软钎料研究中应当考虑因超电势变化而引起的问题。

Overpotential Research of Sn-Ag System Electronic Solders

Electronic lead-free solders have become the focus of the study recently because of the development of Surface Mount Technology (SMT) and rising concern over the toxicity of lead commercial industries.Research electrochemistry properties of the Sn-Ag system electronic solders,compare to traditional Sn-Pb solders.It shows that,in different acidic and alkali solutions,the overpotentials have great difference between them.It will decrease when the content of Bi rises.It also gives some advice on the effect of the solder overpotential in the research and the development of the lead-free solders.