| 新型聚醚酰亚胺改性环氧树脂结构粘合剂 |
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| 引用本文： | 李善君,金坚勇,余英丰,朱强,唐晓林,崔峻. 新型聚醚酰亚胺改性环氧树脂结构粘合剂[J]. 热固性树脂, 2001, 16(4): 8-11 |
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| 作者姓名： | 李善君 金坚勇 余英丰 朱强 唐晓林 崔峻 |
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| 作者单位： | 复旦大学高分子科学系, |
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| 摘 要： | 用新型聚醚酰亚胺 (PEI)改性四官能环氧树脂可以获得高强度、能长期耐温 2 0 0℃以上的结构粘合剂。基础研究表明 ,剪切强度除与加入的PEI量有关外 ,还与PEI分子质量、固化剂DDS用量等因素有关 ,其原因是不同的相结构所致
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| 关 键 词： | 聚醚酰亚胺 环氧树脂 结构粘合剂 增韧 |
| 文章编号： | 1002-7432(2001)04-0008-04 |
THE EPOXY STRUCTURE ADHESIVE MODIFIED BY NEW POLYETHERIMIDE |
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| LI Shan-jun,JIN Jian-yong,YU Ying-feng,ZHU Qiang,TANG Xiao-lin,CUI Jun. THE EPOXY STRUCTURE ADHESIVE MODIFIED BY NEW POLYETHERIMIDE[J]. Thermosetting Resin, 2001, 16(4): 8-11 |
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| Authors: | LI Shan-jun JIN Jian-yong YU Ying-feng ZHU Qiang TANG Xiao-lin CUI Jun |
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| Abstract: | Epoxy resin TGDDM(tetraglycidy1 4,4' diaminodiphenyl methame)was modified by new polyetherimide(PEI)to prepare structure adhesive with excellent mechanical properties and usable temperature more than 200℃ in long time.The test showed that its shear strength was not only correlated with PEI content but also with molecular weight of PEI,content of curing agent DDS(diaminodiphenyl sulfone)and other factors. |
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| Keywords: | TGDDM Epoxy resin Polyetherimide Structure adhesive Modifying DDS Curing agent |
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