| 微硅型光机电系统集成化技术中的金属布线 |
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| 引用本文： | 温志渝,胡松,钟先信,费龙.微硅型光机电系统集成化技术中的金属布线[J].半导体光电,1996(4). |
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| 作者姓名： | 温志渝 胡松 钟先信 费龙 |
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| 作者单位： | 重庆大学 |
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| 摘 要： | 针对微硅型光机电系统集成化技术中电路和金属布线与硅微各向导性深腐蚀工艺之间的不相容问题，从寻求一种电路和金属布线保护层的思想出发，提出了用ＳｉＯ２／Ｃｒ复合膜作电路和布线保护膜的新工艺方法。解决了微硅型光机电系统集成技术中长期存在的电路和布线中的关键技术。
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| 关 键 词： | 微硅型光机电系统 集成化技术 金属布线 各向异性腐蚀 |
Circuit wiring technology in the micromachine optoelectronic integrated system on silicon wafer |
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| WEN Zhiyu,HU Song,ZHONG Xianxin, FEI Long.Circuit wiring technology in the micromachine optoelectronic integrated system on silicon wafer[J].Semiconductor Optoelectronics,1996(4). |
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| Authors: | WEN Zhiyu HU Song ZHONG Xianxin FEI Long |
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| Abstract: | In order to find a new type of circuit and metal wiring protection film to solve the uncompatible problems between the circuit and metal wiring technology in micromachine-optoelectronic integrated system and anisotropic deep-etching fabrication in silicon wafer,we put forward a new fabrication techniques which use SiO2/Cr compound film as a circuit and metal wiring protection film. Meanwhile,we has solved the key technology problem how to protect the circuit and metal wiring,which has been existing in micromechanical optoelectronic integrated system for a long time. |
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| Keywords: | s:Micromachine-optoelectronic System Integrated Technology Metal Wiring Anisotropic Etching |
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