|
|||||
|
|
| 圆片级封装的研究进展 | |
| 引用本文： | 刘培生,仝良玉,黄金鑫,沈海军,施建根,朱海清. 圆片级封装的研究进展[J]. 电子元件与材料, 2012, 31(1): 68-72 |
| 作者姓名： | 刘培生 仝良玉 黄金鑫 沈海军 施建根 朱海清 |
| 作者单位： | 1. 南通大学江苏省专用集成电路设计重点实验室,江苏南通226019;南通富士通微电子股份有限公司,江苏南通 226006 2. 南通大学江苏省专用集成电路设计重点实验室,江苏南通,226019 3. 南通富士通微电子股份有限公司,江苏南通,226006 |
| 基金项目： | 江苏省高校自然科学重大基础研究项目资助(No.10KJA40043):国家科技重大专项"02专项"资助项目，2010年江苏省企业博士集聚计划资助项目 |
| 摘 要： | 圆片级封装(wafer level package,WLP)因其在形状因数、电性能、低成本等方面的优势,近年来发展迅速。概述了WLP技术近几年的主要发展。首先回顾标准WLP结构,并从焊球结构等方面对其进行了可靠性分析。其次介绍了扩散式WLP工艺以及它的典型应用,并说明了扩散式WLP存在的一些可靠性问题。最后总结了WLP技术结合硅通孔技术(TSV)在三维叠层封装中的应用。 |
| 关 键 词： | 圆片级封装 标准WLP 综述 扩散式WLP 3D叠层封装 |
Research progress of wafer level package |
|
| LIU Peisheng,TONG Liangyu,HUANG Jinxin,SHEN Haijun,SHI Jiangen,ZHU Haiqing. Research progress of wafer level package[J]. Electronic Components & Materials, 2012, 31(1): 68-72 | |
| Authors: | LIU Peisheng TONG Liangyu HUANG Jinxin SHEN Haijun SHI Jiangen ZHU Haiqing |
| Affiliation: | 1.Jiangsu Key Laboratory of ASCI Design,Nantong University,Nantong 226019,Jiangsu Province,China;2.Nantong Fujistu Microelectronics Co.,Ltd,Nantong 226006,Jiangsu Province,China) |
| Abstract: | Wafer level package(WLP) has obtained a fast development in recent years owing to its advantages in the small form factor,high electrical performance and low cost etc.The main progresses of WLP are summarized in recent years.The structure of fan-in WLP is reviewed in the first part and the reliability of solder joints is analyzed from the aspects of solder ball structure and so on.Then,the fabrication process and its typical application of fan-out WLP are introduced.The reliability issues associated with fan-out WLP are also briefly described.In the last part,3-D stacking package incorporated with WLP and through silicon via technology(TSV) is discussed. |
| Keywords: | wafer level package fan-in WLP review fan-out WLP 3-D stacking package |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |