| 高密度LED焊点微空洞的X射线检测和分析 |
| |
| 引用本文： | 王欣欣,刘建萍,郭福,刘莉,浮婵妮. 高密度LED焊点微空洞的X射线检测和分析[J]. 电子元件与材料, 2012, 31(1): 64-67 |
| |
| 作者姓名： | 王欣欣 刘建萍 郭福 刘莉 浮婵妮 |
| |
| 作者单位： | 1. 北京工业大学材料科学与工程学院,北京,100124
2. 北京利亚德光电股份有限公司,北京,100091 |
| |
| 摘 要： | 利用高精度X射线检测设备分别对用Sn37Pb焊膏和Sn3.0Ag0.5Cu焊膏组装的高密度LED灯板进行焊后和老化后的微空洞检测,观察了焊点的微空洞缺陷,并计算微空洞尺寸。结果表明:老化前微空洞面积与焊点面积比在10%~25%的,Sn3.0Ag0.5Cu焊点中约含25.5%,略大于Sn37Pb焊点的23.5%,且明显小于Sn3.0Ag0.5Cu焊点老化后的31.4%。两种焊点老化前后微空洞所占面积比都在<25%的合格范围内,但Sn3.0Ag0.5Cu焊点更易形成微空洞。
|
| 关 键 词： | LED组装 X射线检测 焊点 空洞 |
X-ray detection and analysis for micro voids of solder joints in density LED packages |
| |
| WANG Xinxin,LIU Jianping,GUO Fu,LIU Li,FU Channi. X-ray detection and analysis for micro voids of solder joints in density LED packages[J]. Electronic Components & Materials, 2012, 31(1): 64-67 |
| |
| Authors: | WANG Xinxin LIU Jianping GUO Fu LIU Li FU Channi |
| |
| Affiliation: | 1.College of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,China;2.Beijing Leyard Optical Co.,Ltd,Beijing 100091,China) |
| |
| Abstract: | X-ray detection facility was employed to investigate micro voids of the Sn37Pb and Sn3.0Ag0.5Cu solder joints in high density LED packages under as-reflowed and isothermal aged conditions.The micro voids inside the joints were observed,the sizes of which were measured.The results show that the area ratio(micro voids area/solder joints area) between 10%-25% of the micro voids inside the Sn3.0Ag0.5Cu solder joints is about 25.5%,which is slightly higher than the 23.5% inside the Sn37Pb solder joints,and is obviously less than the 31.4% after isothermal aging.The area ratios of the micro voids inside the Sn3.0Ag0.5Cu and Sn37Pb solder joints are all within the acceptable range(<25%),but the Sn3.0Ag0.5 Cu solder joints are easier to form the micro voids after reflowing. |
| |
| Keywords: | LED package X-ray detection solder joint void |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
