| Ag-Ti_4活性钎料钎焊AlN与W-Cu合金研究 |
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| 引用本文： | 李慧,秦明礼,钟小婧,曲选辉,陆艳杰,张小勇.Ag-Ti_4活性钎料钎焊AlN与W-Cu合金研究[J].真空电子技术,2009(4):32-35. |
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| 作者姓名： | 李慧 秦明礼 钟小婧 曲选辉 陆艳杰 张小勇 |
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| 作者单位： | 1. 北京科技大学材料科学与工程学院,北京,100083
2. 北京有色金属研究总院,北京,100088 |
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| 摘 要： | 研究了在真空条件下采用Ag—Ti4活性钎料对AlN陶瓷与W—Cu合金的活性钎焊。试验获得了性能良好的AlN陶瓷与W—Cu合金的焊接组件，力学性能测试发现，剪切强度可达114.9MPa，试样断裂发生在AlN陶瓷一侧。通过SEM，EDX方法分析了焊接层的显微结构和元素分布，分析了连接强度较高的原因。通过XRD分析方法测定了焊接的冶金结合及新相的生成。
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| 关 键 词： | Ag—Ti活性钎料 活性钎焊 显微结构 封接强度 |
A Study on the Active Brazing of AlN to W-Cu Alloy with Ag-Ti4 Active Filler Alloy |
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| LI Hui,QIN Ming-li,ZHONG Xiao-jing,QU Xuan-hui,LU Yan-jie,ZHANG Xiao-yong.A Study on the Active Brazing of AlN to W-Cu Alloy with Ag-Ti4 Active Filler Alloy[J].Vacuum Electronics,2009(4):32-35. |
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| Authors: | LI Hui QIN Ming-li ZHONG Xiao-jing QU Xuan-hui LU Yan-jie ZHANG Xiao-yong |
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| Affiliation: | LI Hui, QIN Ming-li, ZHONG Xiao-jing QU Xuan-hui , LU Yan-jie, ZHANG Xiao-yong (1. College of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China;2. General Research Institute for Nonferrous Metals, Beijing 100088, China) |
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| Abstract: | AIN ceramic and W-Cu alloy had been brazed using Ag-Ti4 active filler metal in the vacuum condition. The results indicated that Ag-Ti4 active filler metal can join AlN with W-Cu alloy directly. The bonding strength was measured, the shearing strength can reach to 114.9 MPa, and the fracture took place in the side of AlN ceramics. The microstructure and phases of bonding area were analyzed by SEM, EDX and XRD. The results are very useful to the broad application of these two materials in the microelectronics field. |
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| Keywords: | Ag-Ti active filler metal Active brazing Microstructure Bonding strength |
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