Creep Properties of Composite Solders Reinforced
with Nano- and Microsized Particles |
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Authors: | Yaowu Shi Jianping Liu Yanfu Yan Zhidong Xia Yongping Lei Fu Guo Xiaoyan Li |
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Affiliation: | (1) School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing, 100022, PR China |
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Abstract: | In the present work the creep properties of Sn37Pb- and Sn0.7Cu-based composite solders reinforced with metallic nano- and
microsized Cu and Ag particles have been studied. First, a series of volume percentages of reinforcements were selected to
optimize the content of reinforcing particles. Then, the composite solder with optimum volume fraction of reinforcement particles,
corresponding to the maximum creep rupture lifetime, was selected to investigate the effect of applied stress and temperature
on the creep rupture lifetime of the composite solder joints. In the creep rupture lifetime test, small single-lap tensile-shear
joints were adopted. The results indicate that composite solders reinforced with microsized particles exhibit better creep
strengthening than composite solders reinforced with nanosized particles, although the mechanical tensile shear strength of
composite solder joints reinforced with nanosized particles may be higher than those reinforced with microsized particles.
Moreover, the creep strengthening action of the reinforcement particles is more obvious under conditions of lower applied
stress or lower test temperature. Strengthening by metallic Cu or Ag reinforcement particles decreases with increasing temperature
or applied stress. The Sn0.7Cu-based composite solder reinforced with microsized Ag particles is a low-cost lead-free solder
that is easy to process and may have good market potential. |
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Keywords: | Composite solder reinforcements particle size creep property |
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