The effect of thin film structure and properties on gold ball bonding |
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Authors: | J E Krzanowski E Razon A F Hmiel |
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Affiliation: | (1) Mechanical Engineering Department, University of New Hampshire, Durham, NH;(2) Kulicke and Soffa Industries, Willow Grove, PA |
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Abstract: | The gold ball bonding process is widely used for making interconnections between integrated circuit chips and package lead
frames, yet the relationships between the wire/substrate materials properties and the bond formation processes are not yet
well understood. While the creation of a metallurgical bond at the interface between the wire and substrate is required, the
deformation of the wire and substrate also play an important role in bond formation. Bonding to thin film substrates is of
particular interest, since thin films often exhibit mechanical behavior distinctly different from bulk materials. In the present
study, a systematic investigation has been conducted to understand the effects of the structure and properties of aluminum
thin films on the quality of gold ball bonds. A series of aluminum thin films was fabricated with systematic variations in
hardness, roughness, thickness, and composition. Gold wires were ball bonded to these substrates, and the bondability and
bond shear strengths were assessed. Metallographic sections of several of these specimens were made and examined in the scanning
electron microscope. The results show that the film thickness has the most dominant effect on the bondability and bond strength;
films that were 0.5 μm thick often exhibited low strength or poor bondability. Very hard films also gave poor results. Ultimately,
these results can be used to predict the wire bond reliability expected from various types of thin film metallization. |
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Keywords: | Aluminum metallization bondability gold ball bonding shear strength |
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