Thermal stability of Ni silicide films on heavily doped n and p Si substrates |
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Authors: | Parhat Ahmet Takashi Shiozawa Takahiro Nagata Kazuo Tsutsui Hiroshi Iwai |
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Affiliation: | a Frontier Research Center, Tokyo Institute of Technology, 4259 Nagatsuta, Midoriku, Yokohama 226-8502, Japan b Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology, 4259 Nagatsuta, Midoriku, Yokohama 226-8502, Japan c Advanced Electric Materials Center, National Institute for Materials Science, 1-1 Namiki, Tsukuba, Ibaraki 305-0044, Japan |
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Abstract: | Electrical and structural properties of Ni silicide films formed at various temperatures ranged from 200 °C to 950 °C on both heavily doped n+ and p+ Si substrates were studied. It was found that surface morphology as well as the sheet resistance properties of the Ni silicide films formed on n+ and p+ Si substrates at the temperatures higher than 600 °C were very different. Agglomerations of Ni silicide films on n+ Si substrates begin to occur at around 600 °C while there is no agglomeration observed in Ni silicide films on p+ Si substrates up to a forming temperature of 700 °C. It was also found that the phase transition temperature from NiSi phase to NiSi2 phase depend on substrate types; 900 °C for NiSi film on n+ Si substrate and 750 °C for NiSi film on p+ Si substrate, respectively. Our results show that the agglomeration is, especially, important factor in the process temperature dependency of the sheet resistance of Ni silicides formed on n+ Si substrates. |
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Keywords: | Ni silicide Thermal stability Agglomeration Sheet resistance Phase transition |
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