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4H-SiC离子注入层的欧姆接触的制备
引用本文:王守国,张义门,张玉明.4H-SiC离子注入层的欧姆接触的制备[J].电子科技大学学报(自然科学版),2003,32(2):203-206.
作者姓名:王守国  张义门  张玉明
作者单位:1.西安电子科技大学微电子所 西安 710071;
基金项目:国防预研基金,8.1.7.3,
摘    要:用氮离子注入的方法制备了4H-SiC欧姆接触层。注入层的离子浓度分布由蒙特卡罗分析软件TRIM模拟提取,Si面4H-SiC-Ni/Cr合金欧姆接触的特性由传输线方法结构进行了测量,得到氮离子注入层的方块电阻Rsh为30 kΩ/square,Ni/Cr合金与离子注入层的欧姆接触电阻ρc为7.1×10-4Ωcm2。

关 键 词:SiC    离子注入    欧姆接触    方块电阻
收稿时间:2002-09-26

Fabrication of Ohmic Contacts to 4H-SiC Created by Ion-Implantation
Abstract.Fabrication of Ohmic Contacts to 4H-SiC Created by Ion-Implantation[J].Journal of University of Electronic Science and Technology of China,2003,32(2):203-206.
Authors:Abstract
Affiliation:1.Institute of Microelectronics,Xidian University Xi'an 710071;2.Department of Electronics,Northwest University Xi'an 710069
Abstract:Doping by nitrogen ion-implantation is used to fabricate the Ohmic contacts of 4H-SiC. The implantation depth profile is simulated with the Monte Carlo simulator TRIM. Ni/Cr/Si-face 4H-SiC Ohmic contacts are measured by Transfer Length Method structures. The result for sheet resistance Rsh of the implanted layers is 30 kΩ/square. The specific contact resistances ρc of Ohmic contacts is 7.1×10-4 Ωcm2.
Keywords:SiC  silicon carbide  ion implantation  Ohmic contact  sheet resistance
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