Sequential environmental stresses tests qualification for automotive components |
| |
| Authors: | MA Bahi P Lecuyer H Fremont J-P Landesman |
| |
| Affiliation: | aATMEL Nantes SA, la Chantrerie – route de GACHET, BP70602, 44300 Nantes cedex 3, France;bIMS Université Bordeaux 1, UMR 5218, BAT. A31, 351 cours de la Libération, 33405 Talence cedex, France;cIMN, UMR 6502, 2 rue de la Houssinière B.P. 32229, 44322 Nantes cedex 3, France |
| |
| Abstract: | The purpose is to create a new qualification methodology for plastic encapsulated electronic components used in an automotive environment at high temperature. It is based on the acceleration of failure mechanisms like ball bond lift (due to intermetallic Au–Al thickness growth), by combination of environmental stresses. The delamination measurement was used as an indicator of potential assembly weaknesses. An optimized package sequential qualification test flow is proposed. |
| |
| Keywords: | |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
