| 大功率白光LED封装技术 |
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| 引用本文： | 张寅,施丰华,徐文飞,范供齐,王海波.大功率白光LED封装技术[J].照明工程学报,2012,23(3):52-55. |
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| 作者姓名： | 张寅 施丰华 徐文飞 范供齐 王海波 |
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| 作者单位： | 1. 南京工业大学材料科学与工程学院,江苏南京,210009
2. 南京工业大学电光源材料研究所,江苏南京,210015 |
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| 基金项目： | 国家高技术研究发展计划(863计划)，院士企业工作站，江苏省自然科学基金 |
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| 摘 要： | 近年来,大功率白光LED封装技术面临着巨大的挑战。在LED封装过程中,LED封装方法、材料、工艺和结构的选择,对LED的出光效率,可靠性,散热等方面有巨大的影响。本文从热学、电学和机械角度详细地评述了大功率白光LED封装技术。
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| 关 键 词： | 大功率LED 封装工艺 固态照明 |
Packaging Technology for High-Power White LED |
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| Zhang Yin
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Shi Fenghua
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Xu Wenfei
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Fan Gongqi
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Wang Haibo.Packaging Technology for High-Power White LED[J].China Illuminating Engineering Journal,2012,23(3):52-55. |
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| Authors: | Zhang Yin Shi Fenghua Xu Wenfei Fan Gongqi Wang Haibo |
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| Affiliation: | Zhang Yin Shi Fenghua Xu Wenfei Fan Gongqi Wang Haibo (1. School of Material Science and Engineering Nanjing University of Technology, Nanjing 210009; 2. Research Institute of Electron-Light material N JUT, Nanjing 210015 ) |
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| Abstract: | Packaging technique of high-power white LED is facing enormous challenge in recent years. In the process of LED packaging, the selection of LED packaging methods, materials, processes and structure has a great influence on LED light extraction efficiency, reliability, cooling and so on. The packaging technique of high-power white LED was summarized in detail in the view of thermology, electrics and mechanics. |
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| Keywords: | high-power EED packaging process solid state lighting |
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