| 激光割胶工艺研究 |
| |
| 引用本文： | 严超,雷群. 激光割胶工艺研究[J]. 印制电路信息, 2009, 0(12): 64-66 |
| |
| 作者姓名： | 严超 雷群 |
| |
| 作者单位： | 大族数控科技有限公司,广东,深圳,518052 |
| |
| 摘 要： | 激光割胶,是一种可以完美替代传统印制插头板手工割胶制程的新工艺。该工艺采用激光等光、机、电一体化控制技术,实现贴胶印制插头板的高效率、高精度割胶制程,可以节省大量人工,并且非常稳定地进行蓝胶的盲切,精度达到±0.1mm,提高产品的良品率,满足PCB行业的生产需求。
|
| 关 键 词： | 印制插头板 激光割胶 效率 精度 |
Research in Laser Cutting for Protective Adhesives |
| |
| YAN Chao,LEI Qun. Research in Laser Cutting for Protective Adhesives[J]. Printed Circuit Information, 2009, 0(12): 64-66 |
| |
| Authors: | YAN Chao LEI Qun |
| |
| Affiliation: | YAN Chao, LEI Qun |
| |
| Abstract: | Laser protective adhesive cutting is the new technics of substituting handcraft perfectly on edge board connecter. The technics has adopted the modern technology of laser,mechanism and electric. It is high efficiency and precision in plastic cutting process on edge board connecter. It can reduce the number of person and cut protective adhesive steadily of blindness. It can reach the precision of ±0.1mm and improve the yield rate. So it can satisfy manufacture in PCB industry. |
| |
| Keywords: | |
| 本文献已被 维普 万方数据 等数据库收录！ |
|
