| 新型低膨胀Mo-Cu合金电子封接材料研究 |
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| 引用本文： | 韩胜利,宋月清,崔舜,夏扬. 新型低膨胀Mo-Cu合金电子封接材料研究[J]. 粉末冶金技术, 2009, 27(3) |
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| 作者姓名： | 韩胜利 宋月清 崔舜 夏扬 |
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| 作者单位： | 北京有色金属研究总院粉末冶金及特种材料研究所,北京,100088 |
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| 摘 要： | 本试验研究了添加活化元素Ni对Mo-Cu合金的相对密度、烧结性能、热导率、电导率、热膨胀系数及组织的影响.研究结果表明:在Mo-Cu合金中加入Ni能降低合金烧结的致密化温度,促进烧结的进行.但Ni的加入降低了合金的导电和导热性能,并且使合金的组织变得粗大,75Mo-20Cu-5Ni的导热系数和95%Al2O3,陶瓷非常匹配,可被用作与其封接的合金.
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| 关 键 词： | Mo-Cu合金 组织性能 致密化 |
The investigation on a new kind of Mo-Cu alloy material for electronic sealing material |
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| Han Shengli,Song Yueqing,Cui Shun,Xia Yang. The investigation on a new kind of Mo-Cu alloy material for electronic sealing material[J]. Powder Metallurgy Technology, 2009, 27(3) |
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| Authors: | Han Shengli Song Yueqing Cui Shun Xia Yang |
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| Affiliation: | Powder Metallurgy and Special Materials Research Department;General Research Institute for Nonferrous Metals;Beijing 100088;China |
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| Abstract: | Mo-Cu alloys with the higher thermal conductivity and lower coefficient of thermal expansion is widely used as electrical packaging materials and heat sink materials.The effects of mass fraction of element Ni on the density,sintering properties,theromo-conductivity,electric-conductivity,and microstructures of Mo-Cu alloys were investigated.The results indicate that addition of element Ni decreases the sintering densification temperature of the alloy.However,it is not beneficial to the theromo-conductivity a... |
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| Keywords: | Mo-Cu alloys properties and microstructures densification |
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