300mm硅圆片的转移推动了半导体生产技术的进步

采用33mm硅圆片生产的集成电路要比硅圆片生产的集成电路增加30％－40％的利润收入。这对于低利润的DRAM和其它低利润积累的商业性产品起到了补救作用。目前这种观点已被许多生产半导体集成电路厂商所接受，并加速了向300mm硅圆片的转移。但转移到300mm硅片生产需投入150－200亿美元巨额资金，它迫使了世界所有的半导体制造商走共同合作、共担风险的道路。

Transition to 300mm Wafer Drives Progress in Semiconductor Processing

It will get 30% ~ 40% incremnt of profits for IC peduction on a 300mm waferas compared to a 200mm wafer. It will make up for the low - profit of DRAM and othercommrcial products in low - profit accumulation. This point of view has accepted by manysemieonductor integnted cireuit manufacturers now, and it will speed up the tIansition to300mm wafer. But it will take a huge invesbent of 15 ~ 20 billion dollars in transition to300mm wafer, so it makes all the setheconductor manufacturers the world over co - operateand risk tLhe experience.