Photolithographic packaging with selectively occupied repeatedtransfer (PL-Pack with SORT) for scalable film optical linkmultichip-module (S-FOLM) |
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Authors: | Yoshimura T. Kumai K. Mikawa T. Ibaragi O. Bonkohara M. |
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Affiliation: | Electron. Syst. Integration Technol. Res. Dept., Assoc. of Super-Adv. Electron. Technol. (ASET), Tokyo; |
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Abstract: | "Photolithographic packaging (PL-pack) with selectively occupied repeated transfer (SORT)" is proposed for optoelectronic microsystem integration. PL-pack with SORT integrates different types of thin-film device pieces into one substrate with desired configurations using an all-photolithographic process. A process design example is presented for a scalable film optical link multichip-module (S-FOLM). A preliminary estimation reveals that PL-Pack with SORT will achieve III-V epitaxial material saving of <1/100 and module cost reduction of <1/10, compared with flip-chip-bonding-based packaging. The result indicates that the process will save on cost and resources simultaneously. A critical issue is how to simplify the procedure for distributing thin-film device pieces onto a substrate. SORT is found to reduce the distribution step count typically by factor of <1/10-1/10000 compared with the conventional one-by-one method. PL-pack with SORT will be extended to the 3R process (reduce, reuse, recycle), which is generally applied to a variety of device/module fabrications |
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