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The effect of varying chill surface roughness on interfacial heat transfer during casting solidification
Authors:William David Griffiths  Ramazan Kayikci
Affiliation:(1) Department of Metallurgy and Materials Science, School of Engineering, University of Birmingham, Edgbaston, Birmingham, B15 2TT, UK;(2) Technical Education Faculty, Department of Materials Technology, Sakarya University, Esentepe, Adapazari, 54090, Turkey
Abstract:Experiments to investigate interfacial heat transfer mechanisms during casting solidification were carried out by varying the surface roughness of a Cu chill used to bring about unidirectional solidification of an Al-4.5 wt.% Cu alloy. Little variation in interfacial heat transfer coefficient with varying chill surface roughness was found, confirming previously published results. Examination of the as-cast surface of the casting showed the presence of predendritic contact areas, and also that the casting surface roughness did not form as a replica of the chill surface, as has often been proposed. Rather, the casting surface roughness was consistently greater than that of the chill, but varied little in the experiments. A sum surface roughness parameter was devised to characterise the casting–chill interface that included the roughness of both surfaces. The value of this parameter was strongly influenced by the greater roughness of the casting surface, rather than the chill surface roughness, and therefore also varied little in the experiments. This lack of variation in the casting surface roughness and hence the sum surface roughness parameter showed how interfacial heat transfer should be more strongly influenced by the greater roughness of the casting surface than of the chill surface, and explains why the interfacial heat transfer coefficient was not strongly influenced by the chill surface roughness in these types of experiments. At the time the work was carried out the authors were in the Manchester Materials Science Centre, University of Manchester and UMIST, Manchester M1 7HS, UK.
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