| PCB设计对焊点强度及坑裂失效的影响 |
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| 引用本文： | 马丽利. PCB设计对焊点强度及坑裂失效的影响[J]. 电子产品可靠性与环境试验, 2013, 0(6): 21-23 |
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| 作者姓名： | 马丽利 |
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| 作者单位： | 工业和信息化部电子第五研究所,广东广州510610 |
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| 基金项目： | 工业和信息化部电子第五研究所发展基金资助项目（12C12） |
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| 摘 要： | 采用正交试验设计的方法，讨论了PCB基材的树脂禽餐、焊盘类型，以及焊盘大小对焊点强度和坑裂失效的影响。结果表明：在3个方面的因素中，PCB基材的树脂含量对焊点强度的影响程度最大。有阻焊膜限定的焊盘类型（SMD）要比无阻焊膜限定的焊盘类型（NSMD）的焊点强度要高，且不容易发生坑裂失效。
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| 关 键 词： | 焊点强度 坑裂 正交试验设计 |
Impact of PCB Design on Solder Joint Strength and Pad Crater Failure |
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| MA Li-li. Impact of PCB Design on Solder Joint Strength and Pad Crater Failure[J]. Electronic Product Reliability and Environmental Testing, 2013, 0(6): 21-23 |
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| Authors: | MA Li-li |
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| Affiliation: | MA Li-li (CEPREI, Guangzhou 510610, China) |
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| Abstract: | The impacts of PCB resin content, pad style and pad dimension on the solder joint and pad crater failure were discussed by orthogonal experiment design. The results suggest that among the three factors studied, PCB resin content has a significant impact on the solder joint strength, and the solder joint with solder mask defined pads （SMD） has a larger strength and lower risk of pad crater failure than that with non-solder mask defined pads （NSMD） |
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| Keywords: | solder joint strength pad crater orthogonal experiment design |
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