Thermal Conductivity Behavior of Carbon Nanotubes Reinforced Copper Matrix Composites |
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Authors: | CHU Ke GUO Hong JIA Cheng-chang YIN Fa-zhang ZHANG Xi-min HAN Yuan-yuan FAN Ye-ming |
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Affiliation: | 1. General Research Institute for Nonferrous Metals, Beijing 100088, China 2. University of Science and Technology Beijing,Beijing 100083,China |
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Abstract: | Carbon nanotubes (CNT) exhibit excellent thermal conductivity.Therefore they are potential reinforcements in composites materials for thermal management applications,where high thermal conductivity and low coefficient of thermal expansion (CTE) are required.In the present study,CNT/Cu composites containing CNTs varying from 0 vol.% to 15 vol.% were prepared,and their thermal conductivity behavior was studied in detail.The results indicated that the thermal conductivity of the composites shows no enhancement by the incorporation of CNTs.The presence of interfacial thermal resistance and high level of porosity are the main reasons for this low thermal conductivity.The well dispersed 0-10 vol.% CNTs composites show a very close to the thermal conductivity of Cu.However,the addition of 15 vol.% CNTs results in a rather low thermal conductivity of CNT/Cu composites due to the presence a high level of porosity induced by the formation of CNT clusters.The present paper also claims that a further substantial enhancement in thermal conductivity is only possible if the nanotubes are randomly oriented in the plane or if they are all aligned in one direction,for which the processing of CNTs-aligning in metal matrix should be developed. |
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Keywords: | carbon-nanotube/copper composites spark plasma sintering thermal conductivity interfacial thermal resistance |
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